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| Standard Products Found Page 1 of 3 Solder Anchor Attachment Method Part Number: 374824B60024 (Vis Number: 037813) This part is in stock and available for immediate delivery: Contact your local sales rep BGA Surface Interface Heat Sink Finish Part Class All T766 Black Anodize A Features and Benefits * New unique wire clip design allows for complete reworkability after assembly * Configurations are available for a wide range of BGA package sizes in any thickness up to 3.0mm * Minimal PC Board real estate is required for mounting * Solder Anchors provide the most rugged mounting in the industry * Each Heat Sink utilizes a phase change pad as the interface for optimal performance Solder anchors are sold separately Part Number Do57 2 Solder anchors must be soldered to the PCB Prior to attaching the heat sink clip. Fin Thickness Fin Thickness # of fins # of fins Base Thickness Across Width Across Length across width across length Width Length Height 35mm 35mm 25mm 1.9mm 2.04mm 2.05mm 8 8 Mechanical Outline Drawing http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037813&attach=&size=... 2/25/2003 Standard Products Found Page 2 of 3 Unless otherwise shown, tolerances are 0.38(.015) Recommended PCB Hole Pattern http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037813&attach=&size=... 2/25/2003 Standard Products Found Page 3 of 3 Thermal Performance *n **f 12 4.27 *Natural convection thermal resistance is based on a 75 C heat sink temperature rise. **Forced convection thermal resistance based on an entering 1.0 m/s (200 lfm) airflow. Due to various heat dissipation paths within a BGA device, please test the heat sink in your application. This data sheet represents only one of a broad range of products we make to cool electronics. Our representatives can help you configure a complete cooling solution for your individual applications. Visit us at www.aavidthermalloy.com * info@aavid.com * (c)2002 Aavid Thermalloy, LLC http://www.aavidthermalloy.com/bin/bga_disp_print.pl?partnum=037813&attach=&size=... 2/25/2003 |
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